Methods for Microscale Laser Shock Peening of Metal Thin Films Specification Cross-reference to Related Applications
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(72) Inventors; and (75) Inventors/Applicants (for US only): ZHANG, Wenwu [CN/US]; 2150 Rosa Road, Hampshire House apt. C9C, Schenectady, NY 12309 (US). YAO, Y., Lawrence [US/US]; 560 Riverside Drive, Apt. 71, New York, NY 10027 (US). (81) Designated States (national): AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
منابع مشابه
Microscale Laser Shock Peening of Thin Films, Part 1: Experiment, Modeling and Simulation
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Microscale Laser Shock Processing (LSP) is a technique that may be potentially used to manipulate the residual stress distributions in metal film structures and thus improve the reliability performances of micro-devices. In this study, microscale LSP of copper thin films on single crystal silicon substrates is investigated. Curvature measurements verify that substantial average compressive resi...
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تاریخ انتشار 2014